Where Did Smartphone Heat Go?
Smartphones have become popular in the past few years due to the performance of personal computers but the size of cellphones. 
However, despite their popularity, all electronic device designers share a common issue: that is heat generated from IC chips. Generally speaking, the more the performance of electronic devices increases, the more heat is generated from their IC chips. This means that it is a major issue to diffuse the generated heat when electronic devices are designed. As heat can damage other parts of devices, computer designers create space to let heat out and install cooling fans to the devices.
However, smartphones are too small and thin to create heat venting space or cooling fans. They are rather required to reduce the size as well as to improve technical performance.  
In order to solve "the heat problem", Kaneka has been researching thermal management materials, which we call "Thermal Solution Materials". We have already achieved the development of a number of new materials.
One of the new materials is "Graphinity", a sheet of crystallized carbon. Despite the thinness of only 25 microns (25/1000 of a millimeter), it can quickly transfer heat in IC chips to the horizontal direction. The capacity of heat spreading is, amazingly, more than six times as great as that of aluminum with the same thickness! Graphinity allows us to control heat inside smartphones, and it works like magic.
Electronic devices are predicted to get even smaller and more advanced. Along with this, the heat issue will be a key factor for electronic devices for a long time as well. Kaneka will continue to support the evolution of electronic devices to make our lifestyles more convenient and advanced.
"Graphinity" is only 25 micron thin to diffuse heat in IC chips!

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