New plant to be constructed in Malaysia for production of polyimide film Capital investment of approximately 8 billion yen designed to expand and enhance competitiveness of business
April 19, 2012
*1 Polyimide film is a highly functional film with superior heat and cold resistance properties. Flexible printed circuit boards account for around 70% of the demand, but it is also widely used for insulation in train motors and airplane wiring as well as in space equipment like information satellites.
*2 Since commercializing the PI business in 1984, Kaneka has focused on the FPC board field. Among the first companies to identify the trend towards fine pitch wiring, the company developed “Apical NPI” as a high dimensional stability grade product. It is currently the leading grade.
At the same time, the Shiga Plant in Japan, which is currently producing Apical NPI, will be converted into a production base for polyimide film (product name: Pixeo*3) for 2-layer flexible copper clad laminates and new high functional grades.
*3 Pixeo is a film that has adhesive layers of thermoplastic PI on either side of the core PI film and is used in 2-layer FPC boards. Compared to conventional 3-layer FPC boards, these boards are more reliable and have greater dimensional stability. Moreover, because they can be made thinner, demand is increasing rapidly, primarily for use in smartphones and tablet PCs. Made using a proprietary manufacturing method, Kaneka’s Pixeo is available in an extensive lineup and has received high marks in the market.
While expanding overseas production, the company will also be actively promoting globalization of development and sales operations. There is already a development and sales framework in place centering on the corporate facilities of Kaneka Trading (Shanghai) Co.,Ltd. (Shanghai, China; General Manager: Yoshihiro Takeda), Kaneka Taiwan Corporation (Taipei, Taiwan; President: Kenji Kurimoto) and Kaneka Korea Corporation (Seoul, South Korea; President: Yoshiki Takeoka). The PI film business will be expanded and made more competitive through the implementation of these measures.
Outline of the New Company
Company name:Kaneka Apical Malaysia Sdn. Bhd.
Capital: 94 million Malaysian Ringgits
Business:Manufacture and sale of electronic products
Established: February 2012
Head office:Pahang, Malaysia
Representative:Masahiro Kozai, Managing Director
Shareholder: Kaneka Corporation (100%)